发明名称 CHIPMOUNTER FOR PICKING ELECTRONICS COMPONENTS UP SIMULTANEOUSLY
摘要 PURPOSE: A chip mounter for simultaneously picking up electronic components is provided to improve pickup performance by simultaneously picking up the electronic components through nozzle spins and a pickup nozzle of a head unit. CONSTITUTION: A component feeder(100) supplies components in a row. A pickup nozzle(204) picks up the components supplied from the component feeder. The pickup unit is comprised of a nozzle spin(202) which supports the pickup nozzle. A transfer feeder(120) transfers a ball feeder(110) and components in a row.
申请公布号 KR20120029153(A) 申请公布日期 2012.03.26
申请号 KR20100091066 申请日期 2010.09.16
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 LEE, TAE YOUNG
分类号 H05K13/04;H05K13/02 主分类号 H05K13/04
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