| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique by which a lead terminal provided to a semiconductor laser device that generates and radiates a laser beam can be fixed at low cost. <P>SOLUTION: In a semiconductor laser device, a lead terminal 5 to be electrically connected to a laser chip penetrates through a penetrating hole 1A formed to a stem 1 on which a laser chip for generating a laser beam is mounted, and the lead terminal 5 is fixed to the stem 1. The lead terminal 5 is inserted into a hole 8A of a tube-like isolator 8 in a state that the tube-like isolator 8 is inserted into the penetrating hole 1A of the stem 1 which is in a high-temperature state. Then, the stem 1 is cooled down to fix the lead terminal 5 to the stem 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
