SUBSTRATE FOR POWER MODULE, METHOD OF MANUFACTURING THE SAME, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a substrate for power module excellent in thermal cyclic reliability, the substrate being capable of preventing an occurrence of an undulation or a wrinkle on a surface of a circuit layer and preventing a thermal stress from acting on a junction interface between a ceramic substrate and the circuit layer during a thermal cyclic loading. SOLUTION: In the substrate for power module 10 with the circuit layer 12 formed of aluminum arranged on one surface of the ceramic substrate 11, the circuit layer 12 has a body layer 12B and a surface hardened layer 12A arranged to be exposed on the one surface side, an indentation hardness Hs of the one surface of the circuit layer 12 is set within a range of 50-200 mgf/μm2, a region with the hardness of 80% or higher of the indentation hardness Hs is regarded as the surface hardened layer 12A, and an indentation hardness Hb of the body layer 12B is lower than 80% of the indentation hardness Hs. COPYRIGHT: (C)2011,JPO&INPIT