发明名称 |
SEMICONDUCTOR MODULE, METHOD FOR FABRICATING THE SEMICONDUCTOR MODULE, AND MOBILE APPARATUS |
摘要 |
A semiconductor module manufacturing method includes a step of bonding a semiconductor wafer, which has a plurality of semiconductor elements each of which has an element electrode formed thereon, on an expansible first insulating resin layer; a step of dicing the semiconductor wafer; a step of expanding the first insulating resin layer to widen a gap between semiconductor elements; a pressure-bonding step of pressure-bonding a metal plate whereupon an electrode is arranged and the semiconductor elements with the widened gaps in between, by having a second insulating resin layer in between, and electrically connecting the electrode and the element electrodes; a step of forming a wiring layer which corresponds to each semiconductor element by selectively removing the metal plate and forming a plurality of semiconductor modules connected by the first insulating resin layer and the second insulating resin layer; and a step of separating the semiconductor modules by cutting the first insulating resin layer and the second insulating resin layer.
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申请公布号 |
US2011193222(A1) |
申请公布日期 |
2011.08.11 |
申请号 |
US20090935854 |
申请日期 |
2009.03.18 |
申请人 |
USUI RYOSUKE;INOUE YASUNORI;NAKASATO MAYUMI;ITO KATSUMI |
发明人 |
USUI RYOSUKE;INOUE YASUNORI;NAKASATO MAYUMI;ITO KATSUMI |
分类号 |
H01L23/485;H01L21/784;H01L23/49 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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