METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to increase the freedom degree of package design by designing the structure of a package which is non-realized through a wire-bonding process. CONSTITUTION: A substrate is prepared. A semiconductor chip(120) is attached on the substrate through a die-bonding process. A primary encapsulation process is implemented to form a protecting part(130) surrounding the semiconductor chip and exposing the die pad(122) of the upper side of the semiconductor chip. Re-wiring circuits(132, 134) are formed on the upper side of the protecting part to be electrically connected with the die pad. A via-hole is formed in the protecting part in order to externally expose the connecting pad which is formed on the substrate. The via-hole is filled with conductive paste. A secondary encapsulation process is implemented to form a protecting layer(140).