| 摘要 |
A FLEXIBLE SUBSTRATE 13 HAVING CONDUCTOR PATTERNS 132 AND 133, AND A NON-FLEXIBLE SUBSTRATE 111 WITH RIGIDITY ARE DISPOSED ADJACENT TO EACH OTHER IN THE HORIZONTAL DIRECTION. THE FLEXIBLE SUBSTRATE 13 AND THE NON-FLEXIBLE SUBSTRATE 111 ARE COVERED WITH INSULATING LAYERS 111 AND 113 SO THAT AT LEAST A PORTION OF THE FLEXIBLE SUBSTRATE IS EXPOSED. VIAS 116 AND 141 ARE FORMED IN THE INSULATING LAYERS 111 AND 116 SO AS TO REACH THE CONDUCTOR PATTERNS 132 AND 133 OF THE FLEXIBLE SUBSTRATE 13, AND WIRINGS 117 AND 142 ARE FORMED BY PLATING TO REACH THE CONDUCTOR PATTERNS 132 AND 133 THROUGH THE VIAS 116 AND 141. THE INSULATING LAYERS 114,115,144 AND 145 ARE LAMINATED ON THE INSULATING LAYERS 111 AND 113, AND CIRCUITS 123 AND 150 ARE FORMED FOR CONNECTION OF WIRING.
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