发明名称 |
Halbleiterbauelement und Verfahren zum Platzieren von Halbleiterbauelementen |
摘要 |
A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer. |
申请公布号 |
DE102008025451(B4) |
申请公布日期 |
2011.04.21 |
申请号 |
DE20081025451 |
申请日期 |
2008.05.28 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA, RALF;MAHLER, JOACHIM;RAKOW, BERND;ENGL, REIMUND;FISCHER, RUPERT |
分类号 |
H01L21/58;H01L21/98;H01L23/14;H01L23/31;H01L23/36;H01L23/48 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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