发明名称 |
JIG FOR ELECTROLYTIC PLATING |
摘要 |
PURPOSE: A jig for electrolytic plating is provided to simultaneously mount multiple substrates on a gap between a pair of substrate fixtures and plate one surface of the substrates. CONSTITUTION: A jig for electrolytic plating comprises a first substrate fixture(110), a second substrate fixture(120), an insulation plate(130), and a fastening unit(140). A latch is formed in the top end of the first substrate fixture. The top end of the first substrate fixture is hinged on the second substrate fixture, and the second substrate fixture is rotated. The insulation plate is rotatably coupled to a gap between the first and second substrate fixtures. The fastening unit is installed in the first substrate fixture and fixes the second substrate fixture.
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申请公布号 |
KR20110028070(A) |
申请公布日期 |
2011.03.17 |
申请号 |
KR20090085985 |
申请日期 |
2009.09.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, DONG GYU;CHUNG, TAE JOON;OH, HUENG JAE;MUN, SEON JAE;CHOI, JIN WON |
分类号 |
C25D17/06 |
主分类号 |
C25D17/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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