发明名称 |
Device package substrate and method of manufacturing the same |
摘要 |
A device package substrate includes: a substrate having a cavity formed on a top surface thereof, the cavity having a chip mounting region; a first interconnection layer formed to extend to the inside of the cavity; a second interconnection layer formed to be spaced apart from the first interconnection layer; a chip positioned in the chip mounting region so as to be connected to the first and second interconnection layers; an insulating layer formed to cover the first and second interconnection layers and the chip and having a contact hole exposing a part of the second interconnection layer; and a bump pad formed in the contact hole so as to be connected to external elements. |
申请公布号 |
US2011062533(A1) |
申请公布日期 |
2011.03.17 |
申请号 |
US20090654417 |
申请日期 |
2009.12.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK SEUNG WOOK;JEON HYUNG JIN;KWEON YOUNG DO |
分类号 |
H01L23/498;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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