| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a dicing tape, the dicing tape, and a method for manufacturing a semiconductor device which can be used for dicing by laser beams, and have antistatic performance. SOLUTION: This dicing tape 1 is used for laser dicing in which a dicing tape is attached to the wafer back, laser beams are transmitted through the dicing tape, and the laser is reached to the inside of a wafer to carry out the dicing of the wafer. The dicing tape 1 includes: the substrate for the dicing tape 11 (hereinafter referred to as the substrate 11); and a sticky layer 12 formed on a substrate 1. COPYRIGHT: (C)2011,JPO&INPIT |
