发明名称 PAD CONDITIONING UNIT, SUBSTRATE POLISHING APPARATUS HAVING THE SAME AND METHOD OF CONDITIONING POLISHING PAD USING THE SAME
摘要 PURPOSE: A pad conditioning unit, a substrate polishing apparatus including the same, and a method for recycling a polishing pad are provided to improve the cleaning efficiency of the polishing pad by spraying cleaning fluid from downside toward the polishing surface of the polishing pad. CONSTITUTION: A processing bath(610) receives a polishing pad(311) in a polishing pad recycling process. A recycling unit(620) is installed at the bottom surface of the processing bath. The recycling unit is in contact with the polishing pad and polishes the polishing surface of the polishing pad. A cleaning nozzle sprays cleaning fluid from downside toward the polishing surface of the polishing pad.
申请公布号 KR20110015994(A) 申请公布日期 2011.02.17
申请号 KR20090073477 申请日期 2009.08.10
申请人 SEMES CO., LTD. 发明人 CHOI, KI HOON;LEE, SEUNG HO
分类号 H01L21/304 主分类号 H01L21/304
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