| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that if a thinner plating conductor is used to form a fine pattern and thereby the wire density is further increased, a disconnection occurs in through-holes and via holes due to cracks during heating or by heat cycle conditions, or a separation between an insulation layer and the plating conductor or other problems occur, and it is made difficult to ensure a sufficient connection reliability. SOLUTION: A multilayer printed wiring board 14 comprises: a laminate made by alternately stacking one or more insulation layers 11, each comprising at least an inorganic filler 16 and a resin 18, and one or more wiring pattern layers 12; and through-holes 13 or via holes 22, each having a plating conductor 17 for electrically connecting between the wiring pattern layers 12. By forming a plurality of pores 15 having a size of not less than 0.5 times nor more than 5.0 times of the grain diameter of the inorganic filler 16 in the insulation layer 11 in contact with the plating conductors 17, the occurrence of cracks in the through-holes 13 or via holes 22 during heating or by heat cycle conditions can be prevented and thereby superior connection reliability can be ensured for the multilayer printed wiring board 14. COPYRIGHT: (C)2011,JPO&INPIT |
