| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that realizes miniaturization of a device by turning the terminal miniaturization and into multiple terminals, and also realizes a three-dimensional mounting structure, and also to provide a semiconductor device and a method of manufacturing the wiring board. SOLUTION: The wiring board 1 comprises an insulating base material 10 having a connection hole 11, an embedded conductor 12 arranged in the range that its back surface does not reach the surface of the connection hole 11, and a wiring layer 14 connected to the embedded conductor 12. The embedded conductor 12 can complement the film thickness of the wiring layer 14 and form a positioning part 110 so as to build the three-dimensional mounting structure in the back side of the connection hole 11. The wiring layer comprises a terminal part 14A and a wiring part 14B of which the film thickness is small, and an electrode part 14C having large film thickness, and making the terminal part 14A and the wiring part 14B thin films and raising its bottom of the embedded conductor 12 are carried out in the identical process. The electrode part 14C of the wiring board 1 is provided with a semiconductor element 2. COPYRIGHT: (C)2006,JPO&NCIPI |
