METHOD AND APPARATUS FOR REDUCING SEMICONDUCTOR PACKAGE TENSILE STRESS
摘要
<p>A semiconductor package is provided having reduced tensile stress. The semiconductor package includes a package substrate and a semiconductor die. The semiconductor die is coupled electrically and physically to the package substrate and includes a stress relieving layer incorporated therein. The stress relieving layer has a predetermined structure and a predetermined location within the semiconductor die for reducing tensile stress of the semiconductor package during heating and cooling of the semiconductor package.</p>
申请公布号
WO2010062334(A1)
申请公布日期
2010.06.03
申请号
WO2009US05838
申请日期
2009.10.28
申请人
GLOBALFOUNDRIES INC.;RYAN, E., TODD;SCHUEHRER, HOLGER;RHEE, SEUNG-HYUN