发明名称 |
Semiconductor laser assembly |
摘要 |
A semiconductor laser assembly includes a substrate 10 having a first mount surface 10a and a second mount surface 10b, and a submount 3 which is mounted on the first mount surface 10a and which is separate from a monitoring photodiode 4. A laser diode 1 is mounted on the submount 3. The monitoring photodiode 4 is mounted on the second mount surface 10b, and an electrode 4a formed on the monitoring photodiode 4 is used as a relay electrode for a metal wire 5a connected to an upper-surface electrode of the laser diode 1.
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申请公布号 |
US7729402(B2) |
申请公布日期 |
2010.06.01 |
申请号 |
US20030695001 |
申请日期 |
2003.10.29 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
NISHIYAMA NOBUHIRO;KURITA KENICHI |
分类号 |
H01S5/00;H01S5/042;G11B7/125;H01L31/12;H01S3/04;H01S5/02;H01S5/022;H01S5/024;H01S5/026;H01S5/0683;H01S5/40 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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