| 摘要 |
<p>An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the retention force. The connectors are designed to withstand the heat of a reflow process through the use of wafer subassemblies that have outwardly facing contact surfaces, avoiding the need for relatively thin walls that could deform during a reflow operation. A backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact footprint. The conductive elements are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity.</p> |
