| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste for filling a via-hole which is preferable from a point of reducing an environmental load since lead is not contained, and which has high connection reliability in the via-hole since there is no occurrence of a flaw in the via-hole after lamination on the multilayer circuit board, and in which resistance value of the via-hole can be reduced much and a binder resin is not contained. SOLUTION: Unleaded solder particles having the melting point of 110 to 240°C, metal particulates having particulate diameter D<SB>90</SB>of 0.1 to 5μm in which integrated amount of particle size distribution in the accumulated particle curve is 90%, and dispersion medium are contained in the conductive paste. COPYRIGHT: (C)2010,JPO&INPIT |
