| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device where glass is not misted even when moisture invades a cavity through a resin since the cavity is not sealed. <P>SOLUTION: The semiconductor device includes: pad electrodes 4 which are connected to an electronic device 1 formed in a semiconductor chip 2A, and formed on the semiconductor chip 2A; a support body 7 which adheres onto the semiconductor chip 2A including the pad electrodes 4 with an adhesive 6, in a state having the cavity 6A on the region with the electronic device 1 formed therein; and a wiring layer 10 which is electrically connected the pad electrodes 4. A through-hole 7A leading to the cavity 6A is formed in the support body 7. <P>COPYRIGHT: (C)2010,JPO&INPIT |
