| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for adjusting the cutting conditions of a semiconductor wafer. <P>SOLUTION: In the method for manufacturing the semiconductor device, a first varnish containing a first adhesive resin composition and a second varnish containing a second adhesive resin composition different from the first one are overlaid on a base material 2. Then, the first and second varnishes are dried to form an adhesive film 1 on the base material 2. A semiconductor wafer W is stuck to the adhesive film 1. The semiconductor wafer W is cut and the adhesive film 1 is notched so that the adhesive film 1 remains partially. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2009302497(A) |
申请公布日期 |
2009.12.24 |
| 申请号 |
JP20080232627 |
申请日期 |
2008.09.10 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
OZAKI YOSHINOBU;HATAKEYAMA KEIICHI;MASUKO TAKASHI;NAKAMURA YUKI;MIYAHARA MASANOBU |
| 分类号 |
H01L21/301;C09J7/00;C09J201/00;H01L21/52;H01L23/12;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/301 |
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