OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFACE COMPLIANT HEAT REMOVAL

摘要

A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device; applying non-adhesive film to the one or more components; identifying a primary component of the one or more components; and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components; and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the one or more components; and placing the heat rejecting device on the corresponding one or more components.