| 摘要 |
<p>A multilayer printed wiring board (10) includes a core substrate (20), an on-core-substrate insulating layer (26) laminated on the core substrate (20) and a capacitor section (40) provided on the on-core-substrate insulating layer (26). The capacitor section (40) is formed with a high dielectric layer (43) sandwiched between a lower electrode (41) storing a negative charge and an upper electrode (42) storing a positive charge. An ionization tendency of metal forming the lower electrode (41) is larger than an ionization tendency of metal forming the upper electrode (42). Metal forming the lower electrode (41) is nickel and metal forming the upper electrode (42) is copper, for example.</p> |
