| 摘要 |
PROBLEM TO BE SOLVED: To provide a normal-temperature bonding device capable of uniformly applying a large load on a bonding surface. SOLUTION: The normal-temperature bonding device is provided with: an angle adjusting mechanism 12 for supporting a first sample table 13 for supporting a first substrate on a first stage 11 so that the direction of the first sample table 13 can be changed; a first drive device 14 for driving the first stage 11 in a first direction; a second drive device for driving a second sample table 46 for supporting a second substrate in a second direction; and a carriage supporting table for supporting the second sample table in the first direction when the second substrate and the first substrate are pressure bonded. The angle adjusting mechanism 12 is formed of a plurality of shims. In this case, the normal-temperature device 1 can apply a large load exceeding the load resistance of the second drive device to the first substrate and the second substrate. Further, the normal-temperature bonding device 1 can use the angle adjusting mechanism 12 to change the direction of the first substrate so that the first substrate contacts in parallel to the second substrate, and can uniformly apply the large load on the bonding surface. COPYRIGHT: (C)2009,JPO&INPIT
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