| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform lift-off of an object to be polished from a polishing surface by safely separating the object to be polished such as a semiconductor wafer from the polishing surface without performing an overhang. <P>SOLUTION: A surface to be polished of the object to be polished retained by a retaining unit 101A is pressed, and a liquid is fed to the polishing surface while the object to be polished and the polishing surface are subjected to relative motion to perform treatment relative to the surface to be polished. After the treatment is completed, in a state where a flow rate of the liquid fed to the polishing surface is reduced, the object to be polished is sucked by the retaining unit 101A to be separated from the polishing surface. When it is determined that the object to be polished is left from the polishing surface and is sucked to the retaining unit, the retaining part is raised with the object to be polished. <P>COPYRIGHT: (C)2009,JPO&INPIT |
