| 摘要 |
A method of processing a wafer having a plurality of devices which are composed of a laminate consisting of an insulating film and a functional film laminated on the front surface of a substrate, along streets for sectioning the plurality of devices, comprising a first trip blocking groove forming step for activating a first laser beam application means to form a blocking groove for dividing the laminate along a street of the wafer while moving the chuck table in a first direction in the processing-feed direction; a second trip blocking groove and dividing groove forming step for activating the first laser beam application means to form a blocking groove for dividing the laminate along a street next to the street which has undergone the first trip blocking groove forming step and also to form a dividing groove along the blocking groove formed by the first trip blocking groove forming step while moving the chuck table in a second direction in the processing-feed direction; and a first trip blocking groove and dividing groove forming step for activating the first laser beam application means to form a blocking groove for dividing the laminate along a street next to the street which has undergone the second trip blocking groove and dividing groove forming step and also, to form a dividing groove along the blocking groove formed by the second trip blocking groove and dividing groove forming step while moving the chuck table in a first direction in the processing-feed direction.
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