发明名称 LASER WORKING APPARATUS, AND LASER WORKING METHOD
摘要 <p>Provided is a laser working apparatus which can apply an auxiliary parting force to the parting plane of the crack in accordance with the progressing situations of a crack, thereby to perform a full-cut work reliably to the terminal end of the substrate. The laser working apparatus comprises substrate supporting mechanisms (15 and 16) for floating an edge side (1), a hook mechanism (17), a hook mechanism moving unit (19) for moving the hook mechanism horizontally, and an auxiliary parting force control unit for controlling the hook mechanism and the hook mechanism moving unit (19) thereby to apply the parting force for aiding the progress of the crack. The auxiliary parting force control unit performs controls to insert a protrusion into the opening of the crack, when the distance between the center substrate parting plane and the edge side parting plane of the opened crack is sufficient, to start the horizontal movement of the hook mechanism thereby to bring the parting plane of the crack and the protrusion close to each other, and to apply the parting force to the parting plane of the crack after the protrusion abuts on the parting plane of the crack.</p>
申请公布号 WO2009084489(A1) 申请公布日期 2009.07.09
申请号 WO2008JP73250 申请日期 2008.12.19
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.;IMURA, ATSUSHI;EJIMATANI, AKIRA 发明人 IMURA, ATSUSHI;EJIMATANI, AKIRA
分类号 B23K26/00;B23K26/10;B23K26/42;B28D5/00;C03B33/09 主分类号 B23K26/00
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