| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated structure wafer with a plurality of cavities (14) which meets a required value of volume of the cavities with sufficient accuracy, and to provide its manufacturing method. SOLUTION: A plurality of penetration openings (6) which penetrate in a thickness direction are formed in an interlayer, namely a second layer (4) in a laminated structure in which three layers, namely a first layer to a third layer (2, 4, 12) are laminated. Upper faces and lower faces of the penetration openings (6) are closed by the upper and lower layers, namely the first and the third layers (2, 12) to form the cavities (14). COPYRIGHT: (C)2009,JPO&INPIT |
