PLASMA ETCH PROCESS FOR CONTROLLING LINE EDGE ROUGHNESS
摘要
<p>Line edge smoothness in a hardmask etch process is improved by widening the chamber pressure process window by applying VHF power and increasing the chamber pressure to near the maximum value of the widened process window.</p>
申请公布号
WO2009067104(A1)
申请公布日期
2009.05.28
申请号
WO2007US25369
申请日期
2007.12.11
申请人
APPLIED MATERIALS, INC.
发明人
BELEN, RODOLFO, P.;HAMMOND IV, EDWARD, P.;HATCHER, BRIAN, K.;KATZ, DAN;PANAGOPOULOS, THEODOROS;PATERSON, ALEXANDER, M.;TODOROW, VALENTIN, N.
