| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device high in reliability without having to install separate components. <P>SOLUTION: This semiconductor device 1 is provided with a semiconductor element 2, a mounting piece 4 for mounting the semiconductor element 2 thereon, and an adhesive layer 3 arranged on the mounting piece 4 for fixing the semiconductor element 2. The semiconductor device 1 is characterized in that the mounting piece 4 has an opening 9 in a part of a mounting region 5 for sticking and fixing the semiconductor element 2 therein, and the semiconductor element 2 is brought into surface contact with the mounting piece 4 in the mounting region 5. <P>COPYRIGHT: (C)2009,JPO&INPIT |
