| 摘要 |
FIELD: metallurgy. ^ SUBSTANCE: solder includes elements at a following ratio, wt %: silicon 9.0-15.0, magnesium 0.1-1.5, zinc 0.2-10, manganese 0.1-0.15, gallium 0.2-0.4, calcium 0.05-0.1, sodium chloride or potassium chloride 0.05-0.1, aluminium - the rest. ^ EFFECT: upgraded quality and hardness of soldered connection. ^ 4 ex |
