HEAT RADIATION PRINTED WIRING BOARD, MANUFACTURING METHOD THEREOF, AND MODULE USING THE BOARD

摘要

PROBLEM TO BE SOLVED: To solve the problem that a conventional printed wiring board has difficulty in radiating heat generated from an electronic component mounted thereon to the outside through a chassis or fins for heat radiation laminated on the printed wiring board. SOLUTION: A heat radiative insulating layer 12 having high heat conduction performance and heat emissivity is used for an insulating layer of a printed wiring board. With this configuration, heat generated from an electronic component 16 mounted on the printed wiring board is radiated (or emitted) from the entire printed wiring board to the outside, thereby cooling the printed wiring board and the electronic component 16 mounted thereon. COPYRIGHT: (C)2009,JPO&INPIT