| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce an inter-terminal short circuit between terminals connecting an upper-stage package and a lower-stage package by decreasing the height of a stacked package. <P>SOLUTION: The semiconductor device has the upper-stage package P2 which has a substrate 21 and a chip 23 formed on a top surface of the substrate 21 and also has a hole H formed in an area blow the chip 23 on the substrate 21; the lower-stage package P1 which has a substrate 11 and a chip 13 mounted on a top surface of the substrate 11; and a conductive ball 1 provided between a reverse surface of the substrate 21 and the top surface of the substrate 11 to electrically connect the upper-stage package P2 and lower-stage package P1 to each other, the chip 13 being disposed below the hole H. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
