METHOD FOR AVOIDING COLLAPSE IN DEVELOPED PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a method for reducing defects in a semiconductor device during manufacturing, particularly, collapse in a pattern without sacrifying the throughput, and to provide a process solution for the method. SOLUTION: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacturing of semiconductor devices. In certain preferable modes, the process solution may reduce post-development defects such as pattern collapse when the solution is employed as a rinse solution either during or after the development of the patterned photoresist layer. COPYRIGHT: (C)2008,JPO&INPIT