| 摘要 |
A stacked multi-chip package and a fabricating method of the same are provided to stack homogeneous or heterogeneous chips by using a flip-chip connecting method and a wire-bonding method using re-wiring technique. A printed circuit board(30) includes a substrate pad(30a). A first re-wiring chip(40) is fixed on the printed circuit board and includes a first semiconductor chip(41) having a first chip pad(41a) and a first re-wiring(47) connected electrically to the first chip pad. A second re-wiring chip(50) is connected to a flip chip through a bump(80) on the first re-wiring chip. A bonding wire(60) is formed to connect electrically a first bonding pad(47a) formed on the first re-wiring with the substrate pad of the printed circuit board. A plurality of grooves are formed on a bottom of the second wiring chip. A track of the bonding wire is formed through a space having the grooves. |
