| 摘要 |
The present invention discloses a thermal management system for a molding system. The thermal management system includes a thermolator mounted onto a movable platen, and a heat exchange reservoir. The heater exchange reservoi r is configured to pump heat into a movable-mold portion to a predetermined temperature, and the thermolator is configured to maintain thermal condition of the movable-mold portion in an operational temperature during the moldin g operation period once the heat exchange reservoir is disconnected from the thermolator.
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