| 摘要 |
PROBLEM TO BE SOLVED: To provide a selective barrier slurry for chemical mechanical polishing. SOLUTION: An aqueous polishing composition useful for polishing a semiconductor substrate is provided. The composition comprises 0.05 to 50 weight percent abrasive and 0.001 to 5 weight percent iota type carrageenan. The iota type carrageenan has a concentration for accelerating the removal rate of tantalum, tantalum nitride, and other tantalum-containing materials. COPYRIGHT: (C)2008,JPO&INPIT |
