| 摘要 |
Layout methods for a substrate are disclosed. In one embodiment, the method includes: defining a first plating line on a non-conducting layer coupled to a first pad; and defining a second plating line on the first conducting layer coupled to a second pad. Along a direction away from the first pad and the second pad, a distance between the first plating line and the second plating line becomes longer. In another embodiment, the method includes: defining a plating line on a non-conducting layer, the plating line being coupled to a pad; and replacing a portion of at least a conducting layer with a non-conducting material, wherein the portion is directly under the plating line. |
