| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film having a low temperature wafer reverse surface-laminating property, hot time bonding force, and reflow resistance jointly, and a semiconductor device by using the same. SOLUTION: This adhesive film is equipped with an adhesive layer consisting of (A) a component having a high molecular weight containing a functional group and having≥100,000 weight-average molecular weight, (B) a thermosetting resin containing a tris-epoxy resin and (C) a resin composition containing a first filler having≥30 m<SP>2</SP>/g BET specific surface area. COPYRIGHT: (C)2008,JPO&INPIT
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