发明名称 |
Microelectronic die having a thermoelectric module |
摘要 |
A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias in the substrate interconnect the thermoelectric module with power and ground planes on the front side of the die substrate.
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申请公布号 |
US7279796(B2) |
申请公布日期 |
2007.10.09 |
申请号 |
US20030638038 |
申请日期 |
2003.08.08 |
申请人 |
INTEL CORPORATION |
发明人 |
HU CHUAN;CHRYSLER GREGORY M.;MAHAJAN RAVI V. |
分类号 |
H01L23/48;H01L23/38;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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