| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an inexpensive semiconductor device and to provide the inexpensive semiconductor device by attaining a stable manufacturing process so as to solve the problem, wherein an external force or thermal stress is imposed on a wafer to cause cracking in the wafer in a bump process included in a semiconductor device manufacturing method. SOLUTION: First of all, dummy holes are bored in the wafer, then the position and size of a suction hole, which is provided to a wafer suction jig used in a manufacturing process are set proper; and a final means, which makes the receiving surface of the wafer suction jig conform to the warped surface of the wafer, is carried out to achieve an object. COPYRIGHT: (C)2007,JPO&INPIT
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