| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode package having an improved emission efficiency, in which a new optical means is introduced in a resin encapsulant, and a light emitted from an LED chip is further converged and extracted toward the desired upper direction. <P>SOLUTION: The light emitting diode package 20 comprises package substrates 21a, 21b having first and second electrode structures 23a, 23b, a light emitting diode 25 mounted on the package substrate and electrically connected to the first and second electrode structures, a resin encapsulant 27 made of a transparent resin to seal the light emitting diode, and a plurality of transparent spherical particles 28 having a refractive index higher than the transparent resin are dispersed in the resin encapsulant. <P>COPYRIGHT: (C)2007,JPO&INPIT |
