| 摘要 |
A digital camera module is provided to reduce the bulk of the camera module, reduce the number of components, and simplify an assemblage process by attaching an IR(Infrared Ray) filter on an image sensor. An IR filter(35) filters a beam of a long wavelength in a beam passing through a lens(31). A CIS(CMOS(Complementary Metal Oxide Semiconductor) Image Sensor) semiconductor chip(41) converts the beam passing through the IR filter(35) into an analog image signal. An ISP(Image Signal Processor) semiconductor chip(45) converts the analog image signal into a digital image signal. The IR filter(35) is formed in an upper surface of the CIS semiconductor chip(41).
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