发明名称 APPARATUS FOR HARDENING BONDED SUBSTRATE USING UV
摘要 An ultraviolet curing apparatus of the bonded substrates are provided to prevent a mask base from breaking due to the thermal expansion caused by a rise in temperature. A light irradiating unit cures the sealant of a bonding substrate. A housing is located at the lower portion of the light irradiating member and includes the bonding substrate and a mask substrate(300). The housing also includes a boding substrate support for loading the boding substrate. A mask substrate support(310) sucks and supports the mask substrate by vacuum in order to control the curing position of the bonding substrate. A driving unit drives the bonding substrate support upwardly and downwardly. The mask substrate support includes a mask base(311) for sucking the mask substrate. A base support(312) supports both sides and the lower portion of the mask base. A guide bearing(313) guides the position according to the thermal expansion of the mask base. A single action cylinder assembly(314) is installed at the rear of the guide bearing, supplies the elastic force to the guide bearing and corrects the position of the guide bearing.
申请公布号 KR20070066378(A) 申请公布日期 2007.06.27
申请号 KR20050127464 申请日期 2005.12.22
申请人 ADP ENGINEERING CO., LTD. 发明人 CHO, HYUN WOO;HA, JOO IL
分类号 G02F1/1339 主分类号 G02F1/1339
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