| 发明名称 |
Semiconductor package structure for vertical mount and method |
| 摘要 |
In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.
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| 申请公布号 |
US2007138503(A1) |
申请公布日期 |
2007.06.21 |
| 申请号 |
US20050311824 |
申请日期 |
2005.12.20 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
GERMAIN STEPHEN S.;CARNEY FRANCIS J.;HULING BRUCE A. |
| 分类号 |
H01L21/48;H01L31/111 |
主分类号 |
H01L21/48 |
| 代理机构 |
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