SURFACE MOUNTING LED SUBSTRATE AND LED

摘要

An LED and a surface mounting LED substrate for use in production of multi-faced surface mounting LEDs can include a resist layer on a conductor pattern that runs from an LED chip-mounted upper surface along a side portion and to a lower surface of the LED substrate. The resist layer is formed at least at a portion that is folded and runs along the lower surface and across a cutting line for separating/dividing at least the multi-faced surface mounting LEDs into discrete surface mounting LEDs. The resist layer is configured to suppress a burr that sometimes develops at a section of the conductor pattern during cutting/dicing of the multi-faced surface mounting LED substrate.