A semiconductor device which includes a power electrode on a surface thereof, a solderable body on the power electrode and a passivation body spaced from but surrounding the solderable body.
申请公布号
EP1756865(A2)
申请公布日期
2007.02.28
申请号
EP20050771435
申请日期
2005.05.27
申请人
INTERNATIONAL RECTIFIER CORPORATION
发明人
STANDING, MARTIN;SAWLE, ANDREW;JONES, DAVID P.;CARROLL, MARTIN;ELWIN, MATTHEW
