发明名称 |
Electronic component and method for its production |
摘要 |
An electronic component includes a semiconductor die which exhibits on its active top side above an active surface area a self-supporting electrically conductive cover layer which is supported by through lines and forms a hollow space to the active surface area. A method for producing the electronic component includes additional features.
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申请公布号 |
US2006234476(A1) |
申请公布日期 |
2006.10.19 |
申请号 |
US20060451951 |
申请日期 |
2006.06.13 |
申请人 |
MECKES ANDREAS;THEUSS HORST;WEBER MICHAEL |
发明人 |
MECKES ANDREAS;THEUSS HORST;WEBER MICHAEL |
分类号 |
H01L21/00;B81B3/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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