A method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding,申请号SG20050001094-传众专利搜索

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发明名称	A method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding
摘要
申请公布号	SG125148(A1)	申请公布日期	2006.09.29
申请号	SG20050001094	申请日期	2003.01.09
申请人	CHARTERED SEMICONDUCTOR MANUFACTURING LTD.	发明人	ALIYU YAKUB;CHOOI SIMON;ZHOU MEI SHENG;SUDIJONO JOHN;GUPTA SUBHASH;ROY SUDIPTO RANENDRA
分类号	C23C18/08;H01L21/4763	主分类号	C23C18/08
代理机构		代理人
主权项
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