| 摘要 |
PROBLEM TO BE SOLVED: To prevent chippings produced when a circuit board is divided from scattering to stick on a mounted surface of a component and reducing stress generated in the circuit board when a circuit board assembly constituted by connecting a plurality of circuit boards mounted with electronic components etc., is separated into the respective circuit boards. SOLUTION: A substrate cutting device for separating the circuit board assembly constituted by connecting the plurality of circuit boards into the respective circuit boards is equipped with a rotary knife cutting the circuit board assembly; a 1st jig arranged on one surface side of the circuit board assembly; and a 2nd jig which is arranged on the other surface side of the circuit board assembly to clamp the circuit board assembly with the 1st jig, and which has a partition for partitioning mounting regions of the circuit board assembly for the components and parts to be cut with the rotary knife. COPYRIGHT: (C)2006,JPO&NCIPI
|
