发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment which can suppress an amount of foreign matters attaching to a test piece during transfer. SOLUTION: The semiconductor manufacturing equipment comprises a vacuum treatment chamber having a gas supplying means and a gas exhausting means; test piece placement electrode to place and hold the test piece in the vacuum treatment chamber; transfer chamber having a gas supplying means and a gas exhausting means; gate valve for opening and closing a passage connecting the vacuum treatment chamber and the transfer chamber; transfer device which includes a transfer arm 9 arranged inside the transfer chamber and a test piece holder 9a attached at the end of the transfer arm, transfers the test piece from the transfer chamber to the vacuum treatment chamber by holding it by the test piece holding portion, and then transfers the test piece after treatment from the vacuum treatment chamber to the transfer chamber; and a gas blowing means 25c which blows a gas against the test piece in linkage with the position of the test piece during transfer to prevent the attachment of floating dust to the surface of the test piece. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006216710(A) 申请公布日期 2006.08.17
申请号 JP20050026892 申请日期 2005.02.02
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 KOBAYASHI HIROYUKI;YOKOGAWA KATANOBU;IZAWA MASARU;MAEDA KENJI;TAMURA SATOYUKI
分类号 H01L21/3065;H01L21/205;H01L21/677 主分类号 H01L21/3065
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