| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small and lightweight capacitive element built-in multilayer metallization wiring board superior in connection reliability and electrical properties. <P>SOLUTION: A method for manufacturing the capacitive element built-in wiring board is provided with a step of preparing a pair of precursor sheets 1 which has a wiring conductor 2 in the surface, and a capacitive element 7 which has a laminate which is formed, by alternately laminating a plurality of electrode layers and a plurality of dielectric layers, and a lead-out electrode portion which is formed by filling with a conductor, a through-hole which penetrates the laminate in the direction of the laminate, a step of arranging a pair of precursor sheets 1 on both sides of the capacitive element 7 so that the wiring conductor 2 in the surface of the precursor sheet 1 is brought into contact with the lead-out electrode which penetrates the laminated body of the capacitive element, and a step of hardening a pair of the precursor sheets 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
